ISO 9455-5:2014
For ISO 9455-5:2014, item title is Soft soldering fluxes — Test methods — Part 5: Copper mirror test; status code is 9599; successor is ISO 9455-5:2020; withdrawn / published date is 2014-06-19, recorded from its source on 2026-08-05.
- Identifier
- ISO 9455-5:2014 verified
- Item title
- Soft soldering fluxes — Test methods — Part 5: Copper mirror test verified
- Status code
- 9599 verified
- Successor
- ISO 9455-5:2020
- Withdrawn / published date
- 2014-06-19 verified
Verified
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What the source says
59300,IS,,ISO 9455-5:2014,Soft soldering fluxes — Test methods — Part 5: Copper mirror test,Flux de brasage tendre — Méthodes d'essai — Partie 5: Essai au miroir de cuivre,2014-06-19,2,['25.160.50'],ISO/TC 44/SC 12,9599,[17172],[81064],"['en','fr']",3,<p>ISO 9455-5:2014 specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.</p>
— isopublicstorageprod.blob.core.windows.net, retrieved 2026-08-05
Source
- isopublicstorageprod.blob.core.windows.nethttps://isopublicstorageprod.blob.core.windows.net/opendata/_latest/iso_deliverables_metadata/csv/iso_deliverables_metadata.csv