# ISO 9455-5:2014 — Withdrawn and superseded ISO standards

For ISO 9455-5:2014, item title is Soft soldering fluxes — Test methods — Part 5: Copper mirror test; status code is 9599; successor is ISO 9455-5:2020; withdrawn / published date is 2014-06-19, recorded from its source on 2026-08-05.

- **Identifier:** ISO 9455-5:2014 _(verified: appears in the quote below)_
- **Item title:** Soft soldering fluxes — Test methods — Part 5: Copper mirror test _(verified: appears in the quote below)_
- **Status code:** 9599 _(verified: appears in the quote below)_
- **Successor:** ISO 9455-5:2020
- **Withdrawn / published date:** 2014-06-19 _(verified: appears in the quote below)_

## What the source says

> 59300,IS,,ISO 9455-5:2014,Soft soldering fluxes — Test methods — Part 5: Copper mirror test,Flux de brasage tendre — Méthodes d'essai — Partie 5: Essai au miroir de cuivre,2014-06-19,2,['25.160.50'],ISO/TC 44/SC 12,9599,[17172],[81064],"['en','fr']",3,<p>ISO 9455-5:2014 specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.</p>

## Source

- https://isopublicstorageprod.blob.core.windows.net/opendata/_latest/iso_deliverables_metadata/csv/iso_deliverables_metadata.csv

Last verified: 2026-08-05. Review by: 2027-02-01.
Part of [Withdrawn and superseded ISO standards](https://referencesource.org/iso-standard-supersessions/).