Reference Source

ISO 9455-17:2002

For ISO 9455-17:2002, item title is Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues; status code is 9599; successor is ISO/PWI 9455-17 | ISO 9455-17:2024; withdrawn / published date is 2002-12-09, recorded from its source on 2026-08-05.

Identifier
ISO 9455-17:2002 verified
Item title
Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues verified
Status code
9599 verified
Successor
ISO/PWI 9455-17 | ISO 9455-17:2024
Withdrawn / published date
2002-12-09 verified
Sourceisopublicstorageprod.blob.core.windows.net
Verified
Review by
DatasetWithdrawn and superseded ISO standards

What the source says

32830,IS,,ISO 9455-17:2002,Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues,Flux de brasage tendre — Méthodes d'essai — Partie 17: Essai au peigne et essai de migration électrochimique de résistance d'isolement de surface des résidus de flux,2002-12-09,1,['25.160.50'],ISO/TC 44/SC 12,9599,,"[54324,84464]","['en','fr']",21,"<p>ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms o

isopublicstorageprod.blob.core.windows.net, retrieved 2026-08-05

Source

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