# ISO 9455-17:2002 — Withdrawn and superseded ISO standards For ISO 9455-17:2002, item title is Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues; status code is 9599; successor is ISO/PWI 9455-17 | ISO 9455-17:2024; withdrawn / published date is 2002-12-09, recorded from its source on 2026-08-05. - **Identifier:** ISO 9455-17:2002 _(verified: appears in the quote below)_ - **Item title:** Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues _(verified: appears in the quote below)_ - **Status code:** 9599 _(verified: appears in the quote below)_ - **Successor:** ISO/PWI 9455-17 | ISO 9455-17:2024 - **Withdrawn / published date:** 2002-12-09 _(verified: appears in the quote below)_ ## What the source says > 32830,IS,,ISO 9455-17:2002,Soft soldering fluxes — Test methods — Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues,Flux de brasage tendre — Méthodes d'essai — Partie 17: Essai au peigne et essai de migration électrochimique de résistance d'isolement de surface des résidus de flux,2002-12-09,1,['25.160.50'],ISO/TC 44/SC 12,9599,,"[54324,84464]","['en','fr']",21,"

ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms o ## Source - https://isopublicstorageprod.blob.core.windows.net/opendata/_latest/iso_deliverables_metadata/csv/iso_deliverables_metadata.csv Last verified: 2026-08-05. Review by: 2027-02-01. Part of [Withdrawn and superseded ISO standards](https://referencesource.org/iso-standard-supersessions/).