Reference Source

ISO 9453:2006

For ISO 9453:2006, item title is Soft solder alloys — Chemical compositions and forms; status code is 9599; successor is ISO/NP 9453 | ISO 9453:2014; withdrawn / published date is 2006-09-22, recorded from its source on 2026-08-05.

Identifier
ISO 9453:2006 verified
Item title
Soft solder alloys — Chemical compositions and forms verified
Status code
9599 verified
Successor
ISO/NP 9453 | ISO 9453:2014
Withdrawn / published date
2006-09-22 verified
Sourceisopublicstorageprod.blob.core.windows.net
Verified
Review by
DatasetWithdrawn and superseded ISO standards

What the source says

41923,IS,,ISO 9453:2006,Soft solder alloys — Chemical compositions and forms,Alliages de brasage tendre — Compositions chimiques et formes,2006-09-22,2,['25.160.50'],ISO/TC 44/SC 12,9599,[17166],"[51107,59299]","['en','fr']",10,"<p>ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:</p><ul><li>tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;</li><li>tin-antimony;</li><li>tin-bismuth;</li><li>tin-copper, with and without silver;</li><li>tin-indium, with and without silver and bismuth;</li><li>tin-silver, with and without copper and bismuth;</li><li>tin-zinc, with and without bismuth.</li></ul><p>ISO 9453

isopublicstorageprod.blob.core.windows.net, retrieved 2026-08-05

Source

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